Note: The job is a remote job and is open to candidates in USA. Encore Semi, Inc. is seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. The role involves owning the 'silicon-to-board' interface and ensuring advanced ASIC designs meet signal integrity, thermal, and reliability requirements.
Responsibilities
- Develop and optimize package layouts
- Perform PDN and signal integrity analysis
- Run simulations and improve design performance
- Collaborate with cross-functional engineering teams
Skills
- Degree in Electrical Engineering or related field
- 10+ years of experience in package design and electrical analysis
- Strong knowledge of power integrity and high-speed signal integrity
- Hands-on experience with tools like Cadence APD, Cadence Clarity, Ansys HFSS, or similar (Siemens, Altium, etc.)
- Experience with advanced packaging (2.5D/3D, flip-chip)
- Strong problem-solving and communication skills
Benefits
- 15 days of PTO per calendar year
- 10 paid Holidays per calendar year
- Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
- Dental & Vision: Company covers 50% of premiums for Employee and Dependents
- Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
- Employee Assistant Program (EAP)
- 401k - Traditional & Roth
- Life/AD&D and Long-Term Disability
- Tuition reimbursement
Company Overview